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ENIG Immersion Gold PCB
| Layers | 2 – Multilayer |
| Material | TG130-TG180 FR-4 |
| Thickness | 0.6-2.0mm |
| Copper Weight | 0.5-3oz |
| Max Size | 650×2000mm |
| Min Trace/ Space | 4/4m il |
| Min Drill | 0.15mm |
| Surface Finish | Immersion Gold, ENIG |
| Solder Mask | green, blue, white |
| Silkscreen | white, black |
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Description
Technical Specifications
ENIG immersion gold PCB products combine FR-4 base material with a surface finish known for excellent flatness, solderability, and corrosion resistance. This finish is widely selected for boards that need fine-pitch assembly, stable contact surfaces, or a more refined surface condition than conventional HASL processes.
Core Specifications
The source page describes ENIG immersion gold PCB as an FR-4 based product covering 2-layer to multilayer structures, finished thickness from 0.6mm to 2.0mm, copper weight from 0.5oz to 3oz, and minimum trace/space of 4mil. Typical solder mask colors include green, blue, and white, and the finish is positioned for a broad range of electronic products.
Why Choose ENIG Surface Finish
ENIG provides a flat and uniform surface, which benefits fine-pitch components, gold-contact areas, and products that need dependable solder wetting. Compared with rougher finishes, it helps improve assembly consistency, supports modern SMT processes, and delivers better corrosion resistance during storage and handling.
Process and Quality Focus
The source content places heavy emphasis on pre-treatment, activation, electroless nickel control, immersion gold thickness, bath activity, cleanliness, and drying management. In practice, reliable ENIG production depends on disciplined chemistry control and stable process monitoring so the finished surface remains solderable and free from defects such as black pad risk.
